Technologie

In unserem Technologiebereich betreiben wir folgende Anlagen:

Nasschemiebänke für die Ätzung und Reinigung von Siliciumscheiben und Glassubstraten

Manufacturer Arias
Sample size
Up to 156 mm x 156 mm
Available processes Alkaline saw damage etching
RCA cleaning
HNF cleaning

3-Kammer-PECVD-Anlage für Substratgrößen bis 40 cm x 40 cm für die Abscheidung von amorphen und mikrokristallinen Siliciumschichten

Manufacturer Von Ardenne Anlagentechnik
Model Viss 400 P, 3-chamber system
Sample size
Up to 400 mm x 400 mm
Available processes a-Si:H layers (doped and undoped)
µc-Si layers (doped and undoped)
a-Si:Ge:H layers (doped and undoped)
a-Si:O:H layers (doped and undoped)
Cell structures a-Si:H pin-cells
Tandem cells
a-Si/c-Si heterojunction cells

1-Kammer PECVD-Anlage zur Abscheidung von dielektrischen Schichten (SiN und SiO)

Manufacturer Centrotherm
Model PECVD-1-300, 1-chamber system
Sample size
Up to 450 mm x 450mm
Available processes SiN passivation layer
SiN antireflection layer
SiO (doped and undoped)
SiO/SiN passivation stacks
a-Si:H (doped and undoped)
µc-Si:H (doped and undoped)
Process temperatures Up to 450°C

Aufdampfanlage zur Aufbringung von Schichten aus bis zu 6 unterschiedlichen Materialien ohne Vakuumbruch

Manufacturer Leybold
Model Univex 450 B
Sample size
Up to 4 samples 156mm x 156 mm
Available processes Deposition of Ag, Al, Cr, Ti, Pd, Cu, Ni, MgF
Special features Up to 6 layers of metals in one run
In situ control of thickness and deposition rate

Sputteranlage zur Herstellung von TCO-Schichten

Manufacturer Balzers
Model PLS 500 including von Ardenne PPS 150 Source
Sample size
Up to 125 mm x 125 mm
Available processes Indium tin oxide (ITO)
Zinc oxide (ZnO)
Aluminium (Al)
Substrate temperatures Up to 250 °C

Zwei Siebdrucker für Substratgrößen bis zu 30 cm x 60 cm

Manufacturer Thieme
Model TES/S-25
Sample size
Up to 125 mm x 125 mm
Available processes Screen printing of Ag front contact for solar cells
Screen printing of Al back contact for solar cells

 

Manufacturer Fleischle
Model SHP-P 50/70
Sample size
Up to 300 mm x 600 mm
Available processes Screen printing of Ag front contact for solar cells
Screen printing of Al back contact for solar cells

Spin-Coater

Manufacturer Polos
Model 300 MCD
Sample size
Up to 200 mm diameter for round samples
156 mm x 156 mm for rectangular samples
Available processes Spin on of dopants
Spin on of photoresist

RIE-Plasmaätzer zur Strukturierung

Manufacturer Oxford Instruments
Model Plasmalab 80 Plus
Sample size
Up to 200 mm diameter for round samples
156 mm x 156 mm for rectangular samples
Available processes Etching of SiN
Etching of SiO
Etching of silicon
Photoresist removal

Glasschneider für Substratgrößen von 1,1 m x 1,4 m

Manufacturer Pankoke
Model 100-5d
Sample size
Up to 1000 mm x 1400 mm
Available processes Cutting of glass
Cutting of TCO coated glass

Markierungslaser

Manufacturer Trumpf
Model VMC 1
Laser wavelength 1064 nm
Sample size
Up to 210 mm x 210 mm
Available processes Marking on silicon surfaces
Cutting of silicon wafers

Durchlaufsinterofen

Manufacturer Centrotherm
Model DO 5000-200 FF
Sample size
Up to 210 mm x 210 mm
Available processes Annealing
Paste drying
Contact firing
Maximum temperature 950°C
Transport Metal belt
Beltspeed Up to 4000 mm/min

Durchlaufdiffusionsofen mit RTP-Zone

Manufacturer Centrotherm
Model DO 5.8.-HBO-DRL
Sample size
Up to 156 mm x 156 mm
Available processes Diffusion processes for phosphorus and boron
Transport Walking String
Special Features Additional rapid thermal processing (RTP) zone